Innovation Roundtable ® Summit 2019

05. - 07. Nov, 2019 / Copenhagen, Denmark

The Innovation Roundtable ® Summit 2019 is the world’s largest congress of corporate innovators. 700 innovation executives from 250 different multinational firms will take this ultimate networking opportunity for connecting with peers. This event has a highly interactive format. The 3 day program includes presentations and interactive labs by over 35 executive speakers and experts, immersive roundtable discussions and 25 hours for networking and connecting with peers.

Since years, Edizon is part of this innovative event. Our Managing Partner Martin Pattera will hold a track talk together with Florian Dahm from PERI. Before and after the track talk you can find us at our exhibitors booth. Meet us there for gathering information about Jobs-to-be-Done and Outcome-Driven-Innovation and how we can help big companies to develop new successful strategies.

Our hearts beat for innovation, therefore we love to discuss your innovation challenges at this great event.

Martin, Gerald, Petr and Manuela look forward to meeting you in Copenhagen.

Track Talk:

  • Title:
    How to create a Growth Strategy based on hidden Customer Needs
    Case Study on JTBD and Outcome-Driven Innovation® in Construction Industry
  • Speakers:
    Martin Pattera, Managing Partner, Edizon
    Florian Dahm, Senior Consultant Strategic Marketing, PERI

November 5-7, 2019

Tivoli Hotel & Congress Center
Arni Magnussons Gade 2
1577 Copenhagen

PERI used ODI to determine the needs of a target group that so far little to no research existed about – Scaffolding E&D contractors in Germany.

“ODI guides our business development from strategy to product management, marketing and sales.” Florian Dahm, PERI GmbH

More infos about this event

Mit dem Laden des Videos akzeptieren Sie die Datenschutzerklärung von YouTube.
Mehr erfahren

Video laden

Bitte Google Recaptcha akzeptieren um dieses Formular zu verwenden

Bitte Google Recaptcha akzeptieren um dieses Formular zu verwenden

Anrede: *    
Nachname: *    
Firma: *